TS 03.70 – Interworking between PLMN and PDN
3GPP TS 03.70 is the 3GPP Technical Specification for Interworking between PLMN and PDN. It is published in 3 releases (Ph2 to R98); the latest version is 7.0.0 in R98.
Defines routing scenarios for calls between Public Data Networks and GSM PLMN, addressing numbering principles and interworking functions.
Releases and versions of TS 03.70
| Release | Latest version | Links |
|---|---|---|
| R98 | 7.0.0 | Read · Download (3GPP) |
| R97 | 6.0.0 | Read · Download (3GPP) |
| Ph2 | 4.0.3 | Read · Download (3GPP) |
Scope of TS 03.70
Category: Core Network (Interworking). Technology generation: 2G. Network layer: CoreNetwork.
Who should read this specification?
- Network operators
- Device manufacturers
- Regulators and standards bodies
Implementation notes
Complexity level: Intermediate. Implementation difficulty: Medium.
Key technologies
Other specifications in the 03 series
- TS 03.66 Mobile Number Portability Technical Realisation
- TS 03.67 Enhanced Multi-Level Precedence Service
- TS 03.68 Voice Group Call Service Stage 2
- TS 03.69 Voice Broadcast Service Stage 2 Specification
- TS 03.71 Location Services (LCS) Stage 2 Specification
- TS 03.72 Call Deflection Supplementary Service Stage 2
- TS 03.73 SoLSA Service Stage 2 Description
- TS 03.78 CAMEL Phase 2 Service Control Architecture
Related glossary terms
Related topics
Frequently asked questions
What is 3GPP TS 03.70?
3GPP TS 03.70 is the 3GPP Technical Specification for Interworking between PLMN and PDN. Defines routing scenarios for calls between Public Data Networks and GSM PLMN, addressing numbering principles and interworking functions.
Which 3GPP releases include TS 03.70?
TS 03.70 is published in 3 releases, from Ph2 to R98. The latest version on 3GPP Explorer is 7.0.0 (R98).
What category does TS 03.70 belong to?
TS 03.70 belongs to the Core Network (Interworking) category of 3GPP specifications. It applies to 2G networks.
View the full specification with interactive table of contents, version history, and AI analysis.
Read Full Specification →