TS 29.173 – Diameter-based SLh Interface for LCS
3GPP TS 29.173 is the 3GPP Technical Specification for Diameter-based SLh Interface for LCS. It is published in 11 releases (Rel-9 to Rel-19); the latest version is 19.0.0 in Rel-19.
Specifies Diameter protocol for SLh interface between GMLC and HSS for Location Services in EPC control plane.
Releases and versions of TS 29.173
| Release | Latest version | Links |
|---|---|---|
| Rel-19 | 19.0.0 | Read · Download (3GPP) |
| Rel-18 | 18.0.0 | Read · Download (3GPP) |
| Rel-17 | 17.0.0 | Read · Download (3GPP) |
| Rel-16 | 16.0.0 | Read · Download (3GPP) |
| Rel-15 | 15.0.0 | Read · Download (3GPP) |
| Rel-14 | 14.0.0 | Read · Download (3GPP) |
| Rel-13 | 13.0.0 | Read · Download (3GPP) |
| Rel-12 | 12.3.0 | Read · Download (3GPP) |
| Rel-11 | 11.1.0 | Read · Download (3GPP) |
| Rel-10 | 10.4.0 | Read · Download (3GPP) |
| Rel-9 | 9.4.0 | Read · Download (3GPP) |
Scope of TS 29.173
Category: Core Network (Location Services (LCS)). Technology generation: Multi-Gen. Network layer: CoreNetwork.
Who should read this specification?
- Network operators
- Device manufacturers
Implementation notes
Complexity level: Advanced. Implementation difficulty: Medium.
Key technologies
Specifications referenced by TS 29.173
- TS 23.003 Numbering, Addressing and Identification
- TS 23.012 Circuit Switched Location Management Procedures
- TS 29.272 MME and SGSN Diameter interfaces to HSS/CSS/EIR
- TS 29.273 EPS AAA Reference Points and Procedures
- TR 21.905 3GPP Terminology and Definitions
- TS 23.271 LCS Stage 2 Specification
- TS 29.002 Mobile Application Part (MAP) Specification
- TS 29.228 IMS Cx and Dx Interface Procedures
- TS 33.210 Network Domain Security for IP Networks
- TS 29.229 Diameter Protocol for Cx/Dx Interfaces
- TS 29.329 Diameter Protocol for Sh Interface
Specifications that reference TS 29.173
- TS 23.002 3GPP System Architecture Overview
- TS 29.002 Mobile Application Part (MAP) Specification
- TS 29.274 GTPv2-C Control Plane Protocol
- TS 23.271 LCS Stage 2 Specification
- TS 32.299 Diameter Charging Applications for 3GPP
- TS 29.272 MME and SGSN Diameter interfaces to HSS/CSS/EIR
- TS 29.336 Diameter-based Interfaces for MTC and Packet Data Networks
- TS 29.338 Diameter protocols for SMS in MME/5GS
- TS 29.337 Diameter T4 Interface for MTC Device Triggering
- TS 29.344 PC4a Interface for ProSe between ProSe Function and HSS
- TS 29.172 EPC LCS Protocol (ELP) specification
- TS 29.230 3GPP Diameter Protocol Codes Specification
Other specifications in the 29 series
- TS 29.165 Inter-IMS Network-to-Network Interface (II-NNI)
- TS 29.168 SBc-AP Protocol Specification
- TS 29.171 LCS-AP between MME and E-SMLC (SLs)
- TS 29.172 EPC LCS Protocol (ELP) specification
- TS 29.175 Nimsas Service Based Interface for IMS AS
- TS 29.176 Nmf Media Resource Management Service
- TS 29.198-01 OSA API Overview and Structure
- TS 29.198-02 Specification 29.198-02
Related glossary terms
Related topics
Related technologies
Frequently asked questions
What is 3GPP TS 29.173?
3GPP TS 29.173 is the 3GPP Technical Specification for Diameter-based SLh Interface for LCS. Specifies Diameter protocol for SLh interface between GMLC and HSS for Location Services in EPC control plane.
Which 3GPP releases include TS 29.173?
TS 29.173 is published in 11 releases, from Rel-9 to Rel-19. The latest version on 3GPP Explorer is 19.0.0 (Rel-19).
What category does TS 29.173 belong to?
TS 29.173 belongs to the Core Network (Location Services (LCS)) category of 3GPP specifications. It applies to Multi-Gen networks.
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