TS 23.741 – MBMS/GCSE_LTE Architecture Enhancements Study
3GPP TS 23.741 is the 3GPP Technical Specification for MBMS/GCSE_LTE Architecture Enhancements Study. It is part of 3GPP Rel-13 (version 13.0.0).
Studies enhancements to MBMS/GCSE_LTE for bearer establishment using target area info, congestion handling, roaming, and MCPTT support.
Releases and versions of TS 23.741
| Release | Latest version | Links |
|---|---|---|
| Rel-13 | 13.0.0 | Read · Download (3GPP) |
Scope of TS 23.741
Category: Services (Group Communication & Broadcast). Technology generation: 4G. Network layer: Services.
Who should read this specification?
- Network operators
- Device manufacturers
- Researchers and academics
Implementation notes
Complexity level: Advanced. Implementation difficulty: Medium.
Key technologies
Other specifications in the 23 series
- TS 23.734 Enhancements for 5GS in Vertical Domains
- TS 23.735 Enhanced Public Warning System (ePWS) Study
- TR 23.737 Satellite Access in 5G Architecture Study
- TS 23.740 Network Slicing Enhancement Study for 5GS
- TR 23.742 Study on SBA Enhancements for 5G
- TS 23.743 UE Radio Capability Signaling Optimization Study
- TS 23.744 Location Enhancements for Mission Critical Services
- TR 23.745 Study on App Layer Support for Factories of the Future in 5G
Related glossary terms
Related topics
Related technologies
Frequently asked questions
What is 3GPP TS 23.741?
3GPP TS 23.741 is the 3GPP Technical Specification for MBMS/GCSE_LTE Architecture Enhancements Study. Studies enhancements to MBMS/GCSE_LTE for bearer establishment using target area info, congestion handling, roaming, and MCPTT support.
Which 3GPP releases include TS 23.741?
TS 23.741 is part of 3GPP Rel-13. The latest version on 3GPP Explorer is 13.0.0 (Rel-13).
What category does TS 23.741 belong to?
TS 23.741 belongs to the Services (Group Communication & Broadcast) category of 3GPP specifications. It applies to 4G networks.
View the full specification with interactive table of contents, version history, and AI analysis.
Read Full Specification →